「無銀倒裝LED芯片」原創技術持有公司Semicon Light積極應對專利侵權

By PR Newswire on 12 Nov 2020

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韓國龍仁2020年11月12日 /美通社/ -- Semicon Light正積極籌備，應對專利侵權，維護其原創技術「無銀倒裝LED芯片」。

Logo of SEMICON LIGHT Co., Ltd
Logo of SEMICON LIGHT Co., Ltd

Semicon Light主營倒裝LED芯片製造，率先研發出無銀倒裝芯片技術，並獲得了倒裝LED芯片反射層相關的原創專利。這家韓國LED芯片製造商2015年在KOSDAQ市場上市，在韓國以及美、中等國註冊了約250項倒裝LED芯片相關的專利。

Semicon Light的無銀倒裝芯片與現有的水平LED芯片不同，是一種新型倒裝芯片，其將LED芯片倒置並直接熔接到基板上，無需單獨進行線焊。該技術採用氧化物材料（DBR，即分佈式布拉格反射鏡），可實現超高反射率和高可靠性。此外，該技術可以輕鬆應用於超小型LED（例如迷你LED或微型LED），從而顯著提高元件性能。目前，此類LED芯片市場正迅速形成。