「無縫焊接」 -- 隆基發佈新型組件封裝技術

By PR Newswire on 31 May 2019

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中國西安2019年5月31日 /美通社/ -- 近日，隆基宣佈：一種可完全消除組件中電池片間距從而提升組件效率的「無縫焊接」(Seamless Soldering) 技術已研發完畢，並計劃於2019年下半年導入量產。經TUV南德2019年5月30日測試，隆基結合「無縫焊接」等技術及創新的組件設計，把雙面PERC組件正面功率紀錄推高到了500.5W。

無縫焊接

「無縫焊接」技術使用了焊帶來實現電池片「疊瓦」式的互聯，完全消除了通常2mm寬的電池片間距，提升效率的同時降低了組件的BOM成本。該技術與現有組件工藝與設備完美兼容，目前已具備非常高的量產成熟度與穩定性，產能升級上較為便利。此外，「無縫焊接」可集成M6單晶硅片、薄硅片、細焊絲或反光焊帶等技術，有很好的技術兼容性。